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Shenzhen XingdaYun Technology Co., Ltd.
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FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger 1/3 oz - 6 oz

Shenzhen XingdaYun Technology Co., Ltd.
Shenzhen XingdaYun Technology Co., Ltd.
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-8632326

FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger 1/3 oz - 6 oz

Place of Origin : Shenzhen, China
Brand Name : XingdaYun
Solder Mask : All kinds of Color
Impedance Control : +/- 10%
Packaging Details : Vacuum for inner packing ,carton for outer packing
Base Material : FR4,CEM-1,CEM-3,Teflon,Rogers,Aluminium,High Tg
Copper Thickness : 1/3 oz- 6 oz
Board Thickness : 0.2 mm - 6.0 mm
Surface Finishing : HASL,LF HASL,ENIG,Gold Finger,Flash Gold,OSP,Carbon,Peelable Mask
Min. Hole Size : 0.2 mm
Min. Line Width : 3 mil
Min. Line Spacing : 3 mil
Layer : 2 - 12 layers
Product : FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger
Certification : ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI
MOQ : 1 Piece/Pieces
Price : Negotiable
Delivery Time : Prototype 3 days, Mass Production 8 Days
Payment Terms : L/C,T/T,Western Union
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FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger 1/3 oz - 6 oz

Specifications

4 Layer immersion Gold PCB
1.China PCB Factory,not Trading Company
2.No MOQ
3.24 hrs Quote
4.Delivery on Time


FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger


1. PCB Capability


Layer2-12 layers
Board thickness0.2-6.0 mm
Laminates typeFR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad
Base copper thickness

Min: 12um (1/3oz)

Max: 140um (4oz) for inner layer;

210um (6oz) for outer layer

Min finished hole sizeBy mechanical drilling: 0.2mm (0.008")
Aspect ratio8:1
Max panel size

Mass production: 540mm × 740m (21.25" × 29.13")

Sample: 540mm × 1100mm (21.25" × 43.3")

Min line width/space3 mil/3 mil
Via hole typeBlind, Burried
Surface finish

HASL/ Lead Free HASL,

Immersion Gold / Silver / Tin,

Flash Gold, Hard Gold plating, Selective thick Gold Plating,

Gold Finger (Gold thickness up to 3um),

Plating Silver,

Carbon ink, Peelable mark, OSP

Solder mask

All kinds of colour,

LPI, Dry Film,

Min S/M pitch (LPI): 0.1mm

Impedance Control

Single trace or differential controlled

50, 60, 70, 100, 110, 120, 130 ±10%

Min bonding pitch0.181mm (center to center)
Min SMT pitch0.400mm (center to center)
Min annular ring0.025mm
Outline finish typeCNC Routing; V-Scoring/Cut; Punch
Tolerances

Min Hole registration tolerance (NPTH) ± 0.025mm

Min Hole registration tolerance (PTH) ± 0.075mm

Min Pattern registration tolerance ± 0.05mm

Min S/M registration tolerance (LPI) ± 0.075mm

Scoring Lines ± 0.15mm

Board thickness (0.1 -1.0mm ) ±15%

Board thickness (1.0 -6.35mm ) ±10%

Board Size Routed ± 0.13mm

Board Size Scored ± 0.2mm

Electrical Testing

Voltage: 10V - 250V

Continuity: 10 - 1000 Ohms



Product Tags:

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FR-4 1.5mm 4 Layer Immersion Gold PCB with Golden Finger 1/3 oz - 6 oz Images

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